Vivo X Flip leaks impressive design with super large circular camera module

Recently, leaker Digital Chat Station has revealed the design of vivo’s upcoming X Flip folding screen phone. This is the first clamshell folding phone of the Chinese manufacturer, expected to be equipped with Snapdragon 8+ Gen 1 chipset. Vivo X Flip is expected to arrive in the Chinese market in early 2023.

Vivo X Flip will have an external rectangular screen, located below the circular camera module. A mock-up of the X Flip shows the phone with a quad-camera setup, three LED flash, and the ZEISS brand logo, although this is yet to be confirmed. All we know about the original design is that the camera module will have a rather large circular shape.

However, we can speculate that there are two or three cameras and LED flash located in the same module. In addition, the use of ZEISS brand cameras would be an interesting option for vivo, as competitors’ clamshell folding phones often do not excel in photography.

Previously, vivo X Flip was also revealed to be equipped with Snapdragon 8+ Gen 1 chip. The remaining specifications will be announced in the near future.